Ximea MC203MG-SY-HDR 20.3MP Monochrome USB3 Industrial Camera with Sony IMX531 CMOS Global Shutter Sensor, HDR, Dual ADC, 18 FPS, 26.4 x 26.4 x 42 mm

SKU
MC203MG-SY-HDR
Quick Overview
Ximea MC203MG-SY-HDR 20.3MP monochrome USB3 industrial camera with Sony IMX531 CMOS global shutter sensor, HDR dual ADC, 4512 x 4512 resolution at 18 FPS, 2.74 µm pixels, 70.3 dB dynamic range, 2.3 e⁻ readout noise, 74% peak QE, C-mount lens, compact 26.4 x 26.4 x 42 mm housing, 37.5 g. Ideal for machine vision, VR/AR, 3D scanning, scientific imaging, and embedded systems.

The Ximea MC203MG-SY-HDR is a high-performance USB 3.1 Gen1 industrial camera equipped with a 20.3 Megapixel monochrome Sony IMX531 CMOS sensor. This advanced 1.1" sensor features global shutter technology for distortion-free image capture at up to 18 frames per second and offers a resolution of 4512 x 4512 pixels. With 2.74 µm pixel pitch and a large 12 x 12 mm active sensor area, this camera delivers sharp, low-noise imaging with exceptional detail and high dynamic range (70.3 dB), making it ideal for precise inspection, metrology, and scientific imaging applications.

The MC203MG-SY-HDR supports high-speed USB3 data transfer at 5 Gbit/s, and its compact housing (26.4 x 26.4 x 42 mm) with a standard C-mount lens interface allows easy integration into space-constrained environments. Features such as dual ADC, 10k e- full well capacity, 2.3 e- readout noise, and 74% peak QE ensure excellent sensitivity and performance. The camera includes 3 GPIO inputs and 3 outputs, hardware and software trigger options, host-side image processing, and programmable ROI and binning. Ideal for machine vision, VR/AR, 3D scanning, and portable systems, this camera delivers robust performance in compact form.

Features:

  • 20.3 MP Monochrome Sony IMX531 CMOS Sensor (4512 x 4512)
  • Global Shutter for distortion-free capture
  • 18 FPS frame rate with USB 3.1 Gen1 interface (5 Gbit/s)
  • 1.1” optical format with 2.74 µm pixel size
  • 70.3 dB dynamic range and 74% peak quantum efficiency
  • Dual ADC and Backside Illumination (BSI) sensor
  • Low readout noise of 2.3 e⁻ and 10,000 e⁻ full well capacity
  • Compact housing (26.4 x 26.4 x 42.0 mm), 37.5g
  • Standard C-Mount lens with customizable mount options
  • Trigger input/output and GPIO: 3 in / 3 out
  • Exposure control from 15 µs to 30 s
  • Software support: Windows, Linux, MacOS + APIs (C++, Python)

Applications:

  • 3D scanning, facial recognition, eye tracking, people counting
  • VR/AR content capture, 360° panoramic imaging
  • Medical imaging, histology, retinal scanning, cell biology
  • Aerial mapping, UAV photogrammetry, drone surveying
  • Broadcast slow motion and sports capture
  • Semiconductor inspection, quality control, metrology
  • Robotic arms, portable vision systems, embedded imaging
  • Low latency visual/audio streaming (LoLa)
Sensor Resolution20.3 MPix
Sensor Resolution (Pixels)4512 x 4512
Sensor VendorSONY
Sensor ModelIMX531
Sensor TypeMonochrome
Sensor TechnologyCMOS
Sensor Size1.1"
Sensor Active Area12 x 12 mm
Sensor Diagonal17.5 mm
Pixel Size2.74 µm
Shutter TypeGlobal shutter
Frame Rate18 FPS
Bit Depth8, 10, 12, 2 x 8, 2 x 10, 2 x 12 bits
On-chip Downsampling2x2
On-chip Decimation2x2
InterfaceUSB3
Data Interface Speed5 Gbit/s
Data Connector TypeUSB3 Micro-B
GPIO CountInputs: 3, Outputs: 3
Exposure Minimum15 µs
Exposure Maximum30 s
Power Consumption3.4 Watt
Heat DissipationNatural convection, Optional Heatsink
Sensor CoolingNo
Special FeaturesDual ADC, Backside illumination
Dynamic Range70.3 dB
Full Well Capacity10000 e-
Saturation Capacity9520.6 e-
Readout Noise2.3 e-
Signal to Noise Ratio40.3 dB
Peak QE74%
Gain Analog Max24 dB
Spectral Range400 - 1000 nm
Lens MountC-mount
Enclosure TypeStandard housing
Physical Dimensions (W x H x D)26.4 x 26.4 x 42.0 mm
Mass / Weight37.5 gram
Ambient Operating Temperature0 - 50 °C
Storage Temperature-25 - 60 °C
Sensor TechnologyCMOS, Pregius™ technology
Acquisition ModesGlobal shutter
Digital Output8, 10, 12 bit RAW pixel data digitization
USB3 Interface OptionsUSB 3.1 default Micro-B with screw lock threads, optional Type-C, flex flat ribbon cable or Micro Coax connectors for embedded vision
General Purpose I/O1x opto-isolated input, 1x opto-isolated output, and 2 non-isolated bidirectional I/O, 4X user configurable LEDs
SynchronizationHardware trigger input, software trigger, exposure strobe output, busy output
Power RequirementsBus powered via USB3 interface
Lens Mount OptionsStandard C mount. Available options are CS mount, S-mount (M12) adapter and board level
Partial Image ReadoutROI / AOI (region / area of interest); Skipping and Binning modes supported
Image ProcessingHost based de-Bayering; sharpening; Gamma; color matrix; true color CMS; lookup table (LUT); hue; saturation; sharpness; white balance
Hot Pixel CorrectionOn camera storage of up to 5000 pixel coordinates; host assisted correction
Auto AdjustmentsAuto white balance; auto gain; auto exposure
Flat Field CorrectionsHost assisted pixel level shading and lens corrections
Signal ConditioningProgrammable debouncing time
SDK / APIProgrammable with C++ and C#, Python
Software Supportone API / SDK for all cameras, adapters and drivers for various image processing Libraries
Firmware UpdatesField firmware update through xiCOP tool
ViewerCamTool viewer
Operating SystemsWindows 10 (x86 and x64), Windows 7 SP1 (x86 and x64), Linux Ubuntu, MacOS 10.11 and newer
Minimum Host HardwareIntel i3 3.0GHz, +2GB RAM memory, NVIDIA or Radeon 128MB, Motherboard with PCIe x1 Gen 2 slot, compatible USB 3.0 host adapter
Environment SideOperating 0°C to 50°C on housing, RH 80% non-condensing, -30°C to 70°C storage Ingress Protection: IP40
ConformityCE, FCC, RoHS, GenICam/GenTL, USB 3.0 SuperSpeed, USB3 Vision Compliant