CIS 3M cameras, including the VCC-3CXP1SW, provide cutting-edge short-wave infrared (SWIR) imaging with high resolution and fast data processing capabilities. These cameras are designed for precise detection across the 400 nm to 1700 nm wavelength range, offering exceptional performance in a wide range of industrial and scientific applications. With a 3.2 MP resolution, these cameras enable high-accuracy imaging for inspections where visible light is insufficient.

These cameras are equipped with global shutter sensors for sharp, distortion-free images in high-speed environments. The CoaXPress interface (CXP-12 x 1 lane) ensures fast data transmission, ideal for real-time processing. A variety of advanced functions such as external trigger support, region of interest (ROI) selection, and defect pixel correction are integrated into these cameras, enhancing their versatility for quality control, material differentiation, and defect detection in industries like semiconductor manufacturing, agricultural testing, food inspection, and pharmaceutical analysis.

The cameras feature PoCXP compatibility and are built for efficient integration into automated systems, enabling high throughput and reliability in production lines. The compact design and robust performance of CIS 3M cameras make them essential for advanced imaging solutions in precision testing and process monitoring.
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