CIS 3M Cameras deliver exceptional short-wave infrared (SWIR) imaging performance with a compact, industrial-grade design built for precision and speed. Engineered for high-resolution inspection and analysis, these cameras capture detailed images within the 400–1700 nm wavelength range—ideal for materials that standard visible-light sensors cannot properly visualize. Each model, including the CIS VCC-3CXP1SW, integrates a 3.2-megapixel global shutter sensor that eliminates distortion during high-speed image capture, ensuring reliability in critical applications.

With a CoaXPress (CXP-12 x 1) interface, CIS 3M Cameras achieve rapid data transfer and seamless system integration for real-time imaging tasks. Features such as PoCXP support, external trigger input, defect pixel correction, and region of interest (ROI) selection make them highly versatile for demanding industries like semiconductor inspection, pharmaceutical research, food safety, and agricultural sorting. Combining accuracy, efficiency, and stability, these cameras represent the next level of industrial SWIR imaging technology.